vrk_2006 Posted September 10, 2006 Posted September 10, 2006 I noticed that the heatsink is causing the motherboard to bend... my mobo is a NF4 Infinity SLi, and the heatsink-fan is stock AMD ... when the mobo is out of the case, the heatsink causes a slight bend in the motherboard... no bend is observed however, when the heatsink is not mounted on the board, ruling out an issue with motherboard assembly ... the retention module has a stiffner below the CPU, and has been mounted properly... mounting on the case has been fine with board mounted properly.. I have seen previous posts in this forum, and common sense states boards should never be warped, but the rather large clamping force from the heatsink will induce a warp.... What I would like to know now is 1. Whether there is an acceptable limit for this warping, as observed by other AMD users? 2. Is it a problem with all stock AMD heatsinks? 3. Which is more likely the cause of problem a. the retention module first Or b. the heatsink Thanks in advance for your time and consideration Share this post Link to post Share on other sites More sharing options...
yfital Posted September 10, 2006 Posted September 10, 2006 i cant answer any of the questions, but i do have the same prob... had to use a bit of force to get the mechanisem in place, locking it was no problem... board slightly bend... it wasnt like that with my W.c. water block (may it r.i.p...) Share this post Link to post Share on other sites More sharing options...
Cuttlefish1212 Posted September 11, 2006 Posted September 11, 2006 A very slight amount of warping should actually be expected (though not visually percieved). The retention module is quite strong. Warping is only a problem if it is excessive and therefore capable of causing stress fractures which would probably snap resistors, bus lines, etc. I would say that if you can visually percieve the warping, then it is excessive. When I say slight warping allowed, I'm talking on the order of microns. Share this post Link to post Share on other sites More sharing options...
vrk_2006 Posted September 11, 2006 Posted September 11, 2006 OK, thanks everybody... Does anyone have a quick reference or link to the dimensions of the back plate mounted below the CPU? I was just wondering if it was a bit too small..... Thanks once again Share this post Link to post Share on other sites More sharing options...
smolt Posted September 11, 2006 Posted September 11, 2006 Had that problem with my BT untill i bolted the board down first then installed the BT Share this post Link to post Share on other sites More sharing options...
Cuttlefish1212 Posted September 12, 2006 Posted September 12, 2006 Yup, as long as the motherboard is bolted to the standoffs, then you should have no percieved warpage. The mobo will warp out of case...if it still warps IN case, then you have a problem..otherwise I wouldn't worry about it. My previous post assumed you had the mobo mounted. Share this post Link to post Share on other sites More sharing options...
yfital Posted September 12, 2006 Posted September 12, 2006 Thats why i hate Thermaltake, They didnt provide enough standoffs and screws, only this "bull crap" plastic standoffs, which doesnt hold the mobo bolted enough, causing it to wrap... Share this post Link to post Share on other sites More sharing options...
Cuttlefish1212 Posted September 12, 2006 Posted September 12, 2006 Plastic...hmpph...cutting costs to save money I suppose...yet how much more could a few brass standoffs cost? :mad: Share this post Link to post Share on other sites More sharing options...
yfital Posted September 12, 2006 Posted September 12, 2006 exactly. well, no, to be honest, its so it will be tool less, cause you just stuck it in, be its crap. bah. Share this post Link to post Share on other sites More sharing options...
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