Parsleybravo Posted September 12, 2009 Posted September 12, 2009 I recently upgraded to an EVGA X58 Classified motherboard, and when I reinstalled my CPU watercooling rig, I noticed that the underside of the socket seems to be exposed on the backside of the motherboard. The mount for my CPU waterblock requires a brace on the back of the MOBO, but I'm worried that the foam (between the metal bracket and the MOBO) could melt onto the socket and kill the motherboard or damage the CPU. Is this something I should be worried about? ~Fire in the Hole~ Share this post Link to post Share on other sites More sharing options...
dr_bowtie Posted September 12, 2009 Posted September 12, 2009 no issue at all...they dont get that hot... Share this post Link to post Share on other sites More sharing options...
Nerm Posted September 12, 2009 Posted September 12, 2009 No need to worry. I have had several boards covered in foam insulation and no issues. Share this post Link to post Share on other sites More sharing options...
Parsleybravo Posted September 12, 2009 Posted September 12, 2009 Cool. (No pun intended.) Thanks. The foam insulation on my last MOBO (XFX 790i Ultra) seemed to melt a little to the backside of the board, at least to the point of sticking, so I just thought I'd ask. Thanks for the input. I'm off to overclock! Cheers. ~Fire in the Hole~ Share this post Link to post Share on other sites More sharing options...
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