Guest_Jim_* Posted December 18, 2018 Posted December 18, 2018 Though there are very few consumer products using High Bandwidth Memory (HBM), it is a technology there is still great interest in, as it can enable greater bandwidth in smaller areas and with less power than traditional memory solutions. Yesterday JEDEC updated the standard for the 2.5D, stacked memory technology, enabling single stacks to reach 24 GB of capacity and speeds up to 307 GB/s. This increase in bandwidth comes from an increase in the per-pin bandwidth to 2.4 Gbps while the 24 GB capacity per-stack comes from support for 16 Gb layers and configurations of stacks up to 12-high. Currently HBM and the need to use an interposer with the packaging makes it more expensive to use than traditional memory solutions. However, as production increases to better satisfy demand for the it that extends beyond GPU VRAM, the price will come down and hopefully make it available for more products that will benefit from the smaller PCB required and less power needed. Source: JEDEC Back to original news post Share this post Link to post Share on other sites More sharing options...
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