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Intel Working With Micron To Improve SSD Capacity


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Intel and Micron have teamed up to create a new generation of NAND architecture with the goal of improving chip density and drive capacity. The technology is known as 3D NAND and stacks memory cells vertically rather than horizontally, similar to the V-NAND solution from Samsung. With the new technology, each memory die can fit up to 48GB allowing for 3.5TB to fit in the M.2 form factor or 10TB in a 2.5" SSD. Intel is planning to release its own drives based on the technology sometime in the near future, with other manufacturers receiving sample chips to make their own drives as well.

Source: Digital Trends


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