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Thermal Adhesive.


Odio

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Arctic Alumina Adhesive vs Arctic Silver Adhesive:

 

Application: Going to Epoxy a waterblock to a NorthBridge.

 

Question: Which one transfers Heat better?

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For RMA you mean? I think they will honor the Ceramique as well as the Silver, same company but just different compound. I found the Ceramique a little better for me anyway. My Opty at 2.7/1.6vcore is reading 33-35 with my Zalman9500, it used to be low 40's with the Silver. Temps are from Core temp and ITE.

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I've already planned on using Ceramique for my thermal goop. I'm asking about thermal Adhesive. The waterblock is not compatible with the northbridge, which uses the clamp system instead of the 4 hole approach.

 

 

 

 

 

P.S: both adhesives are made by Artic Silver.

 

P.S.S: Alumina Silver

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I would use the ceramic/alumina. It's non-conductive and non-capacitive for bare chips. Silver can short you out if you're not careful.

 

Aluminum is a metal and as such also conducts electricity. I generally use only Silver TIM because it has a higher thermal conductivity than ceramic or aluminum. If you need something non-conductive then use a ceramic TIM.

 

I've only seen aluminum and silver based thermal adhesives. If you want to be able to remove it in the future; just mix the thermal adhesive 1:1 with thermal grease. Only make sure you use thermal grease and adhesive based on the same metal.

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I really don't think gluing a waterblock to your chipset is a good idea at all - the strain from the tubing could easily tear the block off the chip while in operation, or worse yet take the chip with it.

 

I'd spend $40 or so and just get a new block that has the appropriate connections.

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