schoolslave Posted February 26, 2007 Posted February 26, 2007 Your are talking about your eVGA 7900GT Video card, right? So you will need to remove the fan/heat sink and apply the AS5 per the instructions for a bare IC. The forum also has Tutorials Which tutorial are you talking about? Share this post Link to post Share on other sites More sharing options...
tasr Posted February 27, 2007 Posted February 27, 2007 http://www.diy-street.com/forum/showthread.php?t=20827 Use it in conjunction with the AS5 link TheNumber337 posted. EDIT People get this confused so here is the dope form Arctic Silver. Not Electrically Conductive:Arctic Silver 5 was formulated to conduct heat, not electricity. (While much safer than electrically conductive silver and copper greases, Arctic Silver 5 should be kept away from electrical traces, pins, and leads. While it is not electrically conductive, the compound is very slightly capacitive and could potentially cause problems if it bridges two close-proximity electrical paths.) Share this post Link to post Share on other sites More sharing options...
schoolslave Posted February 27, 2007 Posted February 27, 2007 So, the safest way would be to use the adhesive? Share this post Link to post Share on other sites More sharing options...
tasr Posted February 27, 2007 Posted February 27, 2007 So, the safest way would be to use the adhesive?Only if you don't want the remove the heat sink. CPU, chipset or GPU, just AS5. Share this post Link to post Share on other sites More sharing options...
schoolslave Posted February 27, 2007 Posted February 27, 2007 Well, this is about the MEMORY on the Graphics card. I don't want to use the stock heatpads. Share this post Link to post Share on other sites More sharing options...
My Ugly PC Posted February 27, 2007 Posted February 27, 2007 OK, this thread is confusing me a bit.. like people are talking over each others heads. With the stock KO heatsink or any other one that is flat and covers the gpu and mem chips, you can't remove the pads because they are needed to fill the space between the HS and the mem IC, as the use of pads implys that there is a difference in height between the GPU and mem chip. If you remove the pads you are removing the HS's only contact with the mem chips, and TIM will not cover this difference in height. Use a different HS or live with the mem pads. If you are using a different HS than described then see below. RE the conductivity/capacitance of AS5 read this thread, of course there are some useless posts in it but the is alot of substance in it as well. [Read the whole thing, its only like 40-50 short posts, worth the 5 min it takes to read it] http://www.overclock.net/amd-air-cooling/1...conductive.html Ugly Share this post Link to post Share on other sites More sharing options...
General Septem Posted February 27, 2007 Posted February 27, 2007 They say it's not the conductivity of AS5 that makes it dangerous, but the capacitance. I'm sure you've all seen Angry's thread where he posts a picture of a customer's Socket A CPU that was covered in AS5 and was resultantly "as dead as dead can die". Share this post Link to post Share on other sites More sharing options...
schoolslave Posted February 27, 2007 Posted February 27, 2007 There isnt really a height difference, and I know that Ceramique would bridge that gap. BUt would it be safe to use it? Share this post Link to post Share on other sites More sharing options...
laserred Posted February 27, 2007 Posted February 27, 2007 Anyway you cut it, I'm not putting ANYTHING that's 99.99% pure micronized silver all over my pricey electronics. It's like sticking your feet in salt water while sitting in the electric chair.... your days are numbered Share this post Link to post Share on other sites More sharing options...
My Ugly PC Posted February 27, 2007 Posted February 27, 2007 There isnt really a height difference, and I know that Ceramique would bridge that gap. BUt would it be safe to use it? Would it fill the space? TIM is not intended to bridge any gap but fill the imperfections between 2 surfaces that are touching. Mind you if you allow it any height, heat will soften it and likely spill it over the sides of the IC leaving no contact at all, or gravity would take the bulk of the now heat-softened TIM to the HS and leave a very bad, spoty contact that would be decidedly worse than a thermal pad, there is a reason those pads are used you know. But if you say the 2 surfaces touch (which if your HS is flat they will not, if you bust out the stock KO hs and look under the pads there are rises in height at each point where mem would go, so the difference in height is that of the pad plus a few MM of extra copper at the mem points, but if they do touch on your particular aftermarket hs) then Ceramique would be the absolute safest possible thing. Of course even then there are 1 in a million scenarios which a semi solid TIM will absorb particles in the airflow and be capable of a short. Keep in mind any potential problems we discuss are only in case the TIM spills over the sides of the IC, neither TIM will have any ill effect if it stays between the HS and the mem chip so apply the TIM conservatively. Ugly Share this post Link to post Share on other sites More sharing options...
schoolslave Posted February 27, 2007 Posted February 27, 2007 ok, Ill try that then, and yes, the heatsink touches the memory chips. Share this post Link to post Share on other sites More sharing options...
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