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  1. Hello Overclockers! I am researching high-performance cooling systems for electronics and was wondering if y'all had any suggestions for new cooling technologies that our team could investigate for a thermal engineering design project. Right now it seems like there are a million ways that we could go; multi-phase cooling, micro-refrigeration, fanless/pumpless cooling, chip-integrated cooing, something with contact resistances, something with heat sink geometry. What do you think will be the next big thing? PS. This is for an engineering senior design project for university
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