Guest_Jim_* Posted January 10, 2018 Posted January 10, 2018 Mushkin has announced a number of products at CES 2018, so it is probably best to just jump right into them. Three new M.2 2280 SSDs are coming from Mushkin: the Pilot; Pilot-E; and Helix-L. The Pilot has capacities ranging from 120 GB and 2 TB with max sequential read of 3.2 GB/s and sequential write of 1.9 GB/s. The Pilot-E SSDs cover from 250 GB to 2 TB and have a max sequential read of 3.5 GB/s and sequential write of 3 GB/s. The Helix-L is a lower cost SSD as it drops DRAM from its build, improving the price to GB ratio. Its capacities reach from 120 GB to 1 TB and the drives have a max sequential read of 2.4 GB/s and max write of 1.7 GB/s. All three of these SSD series offer end-to-end data path protection, LDPC ECC, global wear-leveling, and a 3-year warranty backing them. Also in the M.2 2280 form factor are new Triactor SSDs, which target more budget-conscious consumers. The Triactor 3DL M.2 2280 SSDs will come in capacities from120 GB to 1 TB and have a max sequential read of 550 MB/s and sequential write of 505 MB/s. These SSDs uses the SATA Revision 3.1 interface and not NVMe 1.3 like the three mentioned above. Mushkin is also launching it first external SSD, the CarbonEXT. It will use the USB 3.1 Gen 1 interface and achieves a maximum throughput of 450 MB/s over its ASMedia ASM1153E USB controller. Both Type-A and Type-C cables are included with the drives that will come in capacities from 120 GB to 1 TB. They will not offer the same capacity, but Mushkin is also launching new SWAP OTG USB 3.1 flash drives. These will be available in both 32 GB and 64 GB capacities and use USB 3.1 to connect with the ability to swap between Type A and Type C connectors. They are USB On-The-Go compatible, which means supporting smartphones and tablets can directly connect to them. The read speeds can reach up to 225 MB/s and write up to 65 MB/s. In addition to all of these SSDs and flash drives, Mushkin has also revealed a new, refreshed Silverline DDR4 heatsink. The new heatsink uses aircraft-grade aluminum to dissipate heat and features a diamond cut design to offer a refined, industrial look that will still turn heads. You can expect to see it on new Silverline DDR4 memory SKUs in Q2 2018. Source: Press Release Back to original news post Share this post Link to post Share on other sites More sharing options...
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