Waco Posted June 26, 2015 Posted June 26, 2015 From AMD: Lower voltage combined with lower clock speeds (remember, this is CMOS, power usage scales with frequency) combined with direct active cooling makes the heat a non-issue. Share this post Link to post Share on other sites More sharing options...
DanTheGamer11 Posted June 26, 2015 Posted June 26, 2015 (edited) But how does being close to another major heat source make it easier to cool :') It's weird that they went with a bare die considering abrasive paste and a mechanical load are being applied directly to it :/ edit for ^ True, but the gddr packages only have one die level(I saw 4 on a plane in a slide somwhere) vs the four stacks with pretty much the area of one die to dissipate it, I wonder if whoever made the hbm has datasheets for it Edited June 26, 2015 by DanTheGamer11 Share this post Link to post Share on other sites More sharing options...
Waco Posted June 26, 2015 Posted June 26, 2015 GPU dies are usually bare. CPU dies were bare for a very long time until heatspreaders became popular (and people still delid for that). The thermal density of air is so low that the core, even being close, likely contributes very little to the heat in the memory. Share this post Link to post Share on other sites More sharing options...
El_Capitan Posted June 26, 2015 Posted June 26, 2015 For DDR3 RAM, 85C (1x refresh rate), or 95C (2x refresh rate) was the thermal operating limit. For HBM, you're using a lot less power than DDR3, DDR4, and GDDR5. In the architecture itself, there are thermal dummy bumps that help with thermal dissipation between the stacks. http://www.hotchips.org/wp-content/uploads/hc_archives/hc26/HC26-11-day1-epub/HC26.11-3-Technology-epub/HC26.11.310-HBM-Bandwidth-Kim-Hynix-Hot%20Chips%20HBM%202014%20v7.pdf Share this post Link to post Share on other sites More sharing options...
bp9801 Posted June 26, 2015 Posted June 26, 2015 Having everything on the die means the core and memory can be actively cooled instead of relying on passive means. Share this post Link to post Share on other sites More sharing options...
DanTheGamer11 Posted June 26, 2015 Posted June 26, 2015 Is the fury x not cooling the hbm modules too waco? pcb/die and interposer transfer heat too Thanks el capitan for the pdf thing. If the leakage and losses for the memory things are the same then hbm seems a bit harder for cooling, didn't know about those dummy bumps, guess they saw a need for them Did you see any of the reviewers showing the memory temp? saw a video and apparently the back of the silicon chip is what you see, so that's why its black, not cause of the reflections Share this post Link to post Share on other sites More sharing options...
Waco Posted June 26, 2015 Posted June 26, 2015 I'm not sure what you're trying to say, but you're not following along. Share this post Link to post Share on other sites More sharing options...
DanTheGamer11 Posted June 26, 2015 Posted June 26, 2015 (edited) repeat then, I'm feeling the same since you mentioned air http://cdn.videocardz.com/1/2015/06/LR-Fury-X.jpg lack of prints of hbm stacks means the hbm isn't cooled/doesn't use paste? http://cdn.videocardz.com/1/2015/06/Biadu-R9-Fury-X-6.jpg that looks nice Edited June 26, 2015 by DanTheGamer11 Share this post Link to post Share on other sites More sharing options...
bp9801 Posted June 26, 2015 Posted June 26, 2015 The HBM chips and GPU core are all on the same die, so if you cool the GPU core, you're also cooling the HBM because they are right there next to it. Share this post Link to post Share on other sites More sharing options...
DanTheGamer11 Posted June 26, 2015 Posted June 26, 2015 I know that, I assumed that, don't see why air was mentioned in that case Didn't see any reviews with memory temp yet, I guess people aren't interested in it since the heatsink covers all whether you want it to or not, that or it doesn't show temps for it? The layout doesn't help my question either, don't think it will be possible to compare to gddr5 or whatever modules Share this post Link to post Share on other sites More sharing options...
bp9801 Posted June 26, 2015 Posted June 26, 2015 The Fury and Nano are air cooled, Fury X is water cooled. Why do you need the memory temperature? When has a review looked at the memory temperature? Who cares about the memory temperature? If you're cooling the GPU, you're also cooling the HBM stacks and VRM. Everything sits under the water cooler on the Fury X, and probably will for the air cooled Fury, too. Share this post Link to post Share on other sites More sharing options...
DanTheGamer11 Posted June 27, 2015 Posted June 27, 2015 We were talking about the air (not sure why tho) between the gpu and the hmb stacks, not how the whole is cooled Hmm thought overclockers looked at memory temps yeah said that in previous comment don't think I get an answer for that q, too many dissimilarities between gddr5 modules and the hbm stacking Share this post Link to post Share on other sites More sharing options...
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