I have the DFI ultra-d board and im trying to get my PWMIC temp down as its a little high. I applied a heatsink to the chip without any real affect on temps. This may come down to the crappy thermal tape that comes with the heatsink. I am planning to use a mix of AS adhesive and the normal AS5 compound together to get the most out of the heatsink. I have read that AS adhesive can basically screw chips over if it touches the pins and forms a bridge between them. Ive seen some sites recommend applying silicone to the pins to protect them before applying the adhesive to the chip. Im interested to know peoples experiences here with using the AS adhesive on these sensitive chips and the methods you have used to avoid damaging anything. The last thing i want to do is right off my mainboard.

Thanks.

I asked the same question... check out some of the techniques they reffered to me.

http://www.dfi-street.com/forum/showthread.php?t=43812

The only problem is as soon as you epoxy a heatsink to the chip your warranty is void. A technique that I found to work was to use ceramique in the center of the chip and put the smallest dot of super glue in each corner and then mount the sink with some good pressure. If you ever need to remove the sink give it a twist and then scrape the remaining dried glue with a razor blade. Leaves no traces.

Nice idea, thanks. Just a question, is it ok if I use arctic silver 5 compound instead of the ceramique stuff?? whats the difference??

I use ceramique on anything with exposed contacts, just incase any might get on them. AS5 is a little better cooling-wise, I just don't like to chance it.

so what your saying is ceramique doesnt pose a threat to the chip itself if it touches the pins??

correct

ok, i think i may keep it safe and get some of the ceramic. On the subject of the positioning of the heatsink, i am basically using 2 small heatsinks that when sat side by side cover the whole PWMIC chip. However they do hang off the chip width ways, is this an issue?? or is it as long as you get good cover over the chip things will be fine?? Any issues using two heatsinks side by side??

After reviewing this site:
http://www.bigbruin.com/reviews05/nf4therm...ndex.php?file=1

I decided to continue my passive cooling adventure and went to the local surplus electronics shop. I spent probably seven dollars on various heatsinks made for tiny parts and proceeded to use the AS5 Epoxy (Parts A and throughout the motherboard. I am very happy with all of my additions and will be making an air cooling guide of my latest video/motherboard cooling solutions.

There are quite a few 6/8 pin mini circuits througout the motherboard that reach temperatures above 40` Celsius that I felt could use some DIY cooling solutions. Check out the site above for DFI Ultra thermal images showing the heat signatures throughout.

My mobo cooling:
http://www.dfi-street.com/forum/showthread...ooling+solution

Sweet mod! I thought of that but ended up going to WC just to try it out.

No worries on all, but here is my opinions:
1. HS hanging off is no issue what-so-ever unless it contacts other electrical components.
2. The HS does not have to cover the whole surface but the more contact area the better as well as preventing hotspots (which is probably non-critical on miscellaneous parts).
3. Two HS side by side on same component? No issue here. Two HS with one connecting to the other? Still no issue but will more than likely exprience higher heat resistances than using a single solid HS. Two HS on different components touching each other? Still no issue because there would be no electrical current present.

What does everybody else think?

What exactly do you mean by this? Do you mean the chip will be hotter than what it would be if you used a single HS? or will two together soak up more heat?

thanks.

Sorry a long delay before answer...

If I put a large single heatsink on a component there is a certain amount of resistance for that material to accept heat from the chip producing the heat. If I put another heatsink on top of the existing heatsink it will also have a resistance to accept heat from the heatsink "producing" the heat. So, if I measured the total height of both heatsinks stacked on top of each other and swapped a single heatsink measuring this total height, then it would help cool the chip better because of the less resistance between the highest fin and the base contacting the chip.

Answering your original question, yes a second heat sink will help cool the original chip even if it is merely stacked on top of the original heatsink.

Side by side will definitely increase the cooling capacity with no worries at all.

i do not have the heatsinks stacked, they are side by side.